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HomeElectronicsKIC’s Mile Moreau to Current Groundbreaking Sensing Expertise at productronica

KIC’s Mile Moreau to Current Groundbreaking Sensing Expertise at productronica


KIC, a famend pioneer in thermal course of and temperature measurement options for electronics manufacturing, is thrilled to announce an unprecedented leap in reflow course of inspection (RPI) know-how. Normal Supervisor Miles Moreau will probably be presenting an unique lecture at productronica on Wednesday, November 15, 2023, on the productronica Discussion board, unveiling the exceptional “Actual-time manufacturing reflow profile inspection, with new sensor know-how for warmth switch detection.”

In at present’s dynamic manufacturing atmosphere, sustaining the very best stage of high quality and course of management is crucial. RPI, or reflow course of inspection, is a essential aspect, alongside SPI and AOI, in realizing real-time course of management all through the meeting line. KIC is proud to introduce NEW SENSOR TECHNOLOGY that provides vital worth to reflow course of inspection by instantly measuring board temperatures throughout manufacturing. This know-how detects adjustments in warmth switch, thus marking a revolutionary development in electronics manufacturing. Moreau will focus on:

  • Reflow Course of Inspection and its significance
  • Introduction to the groundbreaking Warmth Switch know-how
  • Sensing know-how’s added worth within the realm of RPI
  • Detecting warmth switch adjustments in convection
  • The position of pyrometers in detecting board jams, board drop, and incorrect recipes

The Evolution of Reflow Course of Inspection (RPI): Reflow Course of Inspection (RPI) has been a cornerstone of precision and automation in thermal processes inside reflow ovens. Developed by business chief KIC, RPI methods have been synonymous with reliability and high quality in electronics manufacturing. KIC’s RPI system includes embedded sensors that monitor temperature, conveyor velocity, and PCBAs as they traverse the oven. By constantly monitoring and calculating temperature profiles, RPI eliminates guide interventions, reduces downtime, and ensures constant PCB high quality.

Introducing Reducing-Edge Sensing Expertise: KIC is proud to introduce a groundbreaking sensing know-how that instantly measures board temperature on the finish of the heated oven part throughout manufacturing. This direct measurement functionality permits real-time monitoring of temperature and convection adjustments. It’s a revolutionary leap in reflow course of inspection know-how.

Advantages of the New Sensing Expertise:

  1. Precision Redefined: Instantly measuring board temperature and warmth switch adjustments throughout manufacturing ensures unparalleled precision and high quality in reflow profiles, monitoring all elements of the oven’s affect on manufacturing boards.
  2. Mixed Board-Degree Temperatures: KIC RPI employs superior algorithms that think about board temperature and ambient temperature at board stage to find out temperature, time, and warmth switch adjustments impacting the reflow profile.
  3. Seamless Integration: Our RPI system actively tracks course of Cpk, offering essential temperature profile knowledge that seamlessly integrates with different MES manufacturing facility automation methods, SPI, and AOI knowledge.

Expertise the Way forward for Electronics Manufacturing: Uncover the way forward for electronics manufacturing with our superior RPI methods outfitted with this revolutionary sensing know-how. Keep forward of the competitors, improve course of effectivity, and guarantee uncompromised high quality in each PCB.

Able to Elevate Your Manufacturing High quality and Course of Management? Contact us at present to discover how KIC’s new warmth switch detection and superior sensing know-how can improve your manufacturing high quality and course of management.

Go to KIC at Corridor A4.214, throughout productronica 2023 to interact with thermal course of specialists, study extra about this groundbreaking know-how, and discover options for soldering and curing processes in electronics manufacturing and semiconductor superior packaging.

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